- SILICONE（SI）
- SILICONE（SI）
| Item | Unit | Parameters |
| Density | g/cm | 2.7 |
| Working Time | min | 60 |
| Hardness | 邵氏A | 30 |
| Thermal Conductivity | W/(m·K) | 2.0 |
| Flame Retardant Level | UL94 | V-0 |
| Dielectric Strength | kV/mm | ≥10 |
| Volume Resistance | Ω·cm | 1.5*1013 |
Product Introduction：
WeSI-0811 is a two-component addition-type room-temperature curing silicone potting adhesive. It features stable performance and quality as well as excellent weather resistance, maintaining rubber elasticity within the temperature range of -50 to 200℃ and possessing outstanding insulation properties. It is suitable for potting of power converters, hybrid integrated circuits, electronic components and connectors, and fully complies with the EU RoHS Directive requirements.
Features:
1. Room temperature curing, heating accelerates curing;
2. Addition curing with no by-products;
3. Extremely low shrinkage;
4. Excellent dielectric properties;
5. Good thermal conductivity;
6. UL94 V-0 level.
| Item | Unit | Parameters |
| Density | g/cm | 1.2±0.2 |
| Mixing Vicosity | mPa·s（25℃） | 600-1000 |
| Tack Free Time | min | 30-40 |
| Hardness | 邵氏A | ≥25 |
| Thermal Conductivity | W/(m·K) | 0.8~1.0 |
| Flame Retardant Level | UL94 | V-0 |
Product Introduction:
WeSI-0810 two-component addition type thermally conductive silicone potting compound is widely used for potting and protection of high-power electronic components, module power supplies, circuit boards and LEDs. It can effectively enhance the integrity of electronic devices and improve their resistance to external impact and vibration. It optimizes thermal conductivity, insulation and flame retardancy between internal components and circuits. It prevents direct exposure of components and circuits to improve the waterproof and moisture-proof performance of devices. Meanwhile, the cured compound features high elasticity, enabling extremely convenient device maintenance.
Features:
1. Room temperature curing;
2. Good fluidity;
3. Excellent operation process;
4. The cured colloid features high thermal conductivity, high flame retardancy and superior electrical performance.
